e-Shuttle

Shuttle service

Disposing of reticle set after each development activities "MOTTAINAI !"

Foundry fabs had introduced a scheme called shuttle service, a method to share development costs among users with multi project reticles, to solve the problem. Thus, the reticle cost of an user becomes lower.

SiExpress^TM

Silicon-Express (SiExpress(TM)) is the shuttle service provided from FUJITSU SEMICONDUCTOR LIMITED.

e-Shuttle, Inc. now takes over the role to run the service. e-Shuttle intends to open SiExpress(TM) not only to customers who supply high-volume LSIs, but also to customers who need to realize their ideas into actual device, such as researchers and start-up companies.

The procee technologies we provide now are 90nm and 65nm process technologies. We would like a customer to design a circit conforming to the process technology of Fujitsu Microelectroniics and realize IPs of the customer on the silicon wafer as a device.

e-Shuttle will accept data from a customer in industry-standard GDSII format, and there is no restriction on the EDA tools as long as FUJITSU SEMICONDUCTOR LIMITED design rules are confirmed. Basically, the device we provide is bare die.

Electron Beam Direct Writing(EBDW) technique

Electron Beam Direct Writing(EBDW) technique is the technology to write the circuit from the design data with electron beam on a wafer Baiscally, all patterns of the circuit are are exposed as single rectangle or continuous rectangles by using electron beam .

So, a photo mask is not required => This reduces manufacturing cost and TAT. e-Shuttle has made Electron Beam Direct Writing(EBDW) technique available for 90nm, 65nm and 45nm CMOS processes, utilizing the extensive experiences from FUJITSU SEMICONDUCTOR LIMITED, Advantest and e-Shuttle.

It is one of the most important goals of e-Shuttle to utilize EBDW technique to SiExpress(TM) and execute ULSI development at reasonable cost.

EBDW technique is not exclusive to SiExpress(TM). Customers who develop FUJITSU SEMICONDUCTOR LIMITED's ASIC and COT products can also take the benefit of prototyping with EB lithography. Although customers will not be able to share the reticle cost with other customers who uses the conventional reticle-based shuttle services, however, they will take an advantage of mask-less lithography technique at reasonable cost and low risk.

FUJITSU SEMICONDUCTOR LIMITED sales and marketing division will support customers to utilize EBDW technique for their products.

Die size provided (GDS area)

90nm Technology: 4.796[mm] x 4.796[mm]
65nm Technology: 4.070[mm]x4.070[mm]

Partners

(in Alphabetical Order)

• Design House/Shuttle Service Sales Partners
  • Dai Nippon Printing Co., Ltd
  • HOYA CORPORATION
  • SILICON ARTIST TECHNOLOGY INC.
  • TOKYO ELECTRON DEVICE LIMITED
  • TOPPAN PRINTING CO., LTD.
• Design House Partner
  • FUJITSU Microelectronics Solutions Limited
• Assembly Partners
  • Fujitsu Integrated Microtechnology Limited.
  • SHIIMA ELECTRONICS INC.