Company Profile
Company Name: e-Shuttle, Inc.
Address
Nomura Fudosan Shin-Yokohama Building 10-23,
Shin-Yokohama, 2-chome, Kohoku-Ku, Yokohama, Kanagawa
Board of Directors
| President | Yoji Hino | Member of the Board and Corporate Senior Vice President of FUJITSU SEMICONDUCTOR LIMITED |
| Executives | Haruyoshi Yagi | Member of the Board and Corporate Senior Executive Vice President of FUJITSU SEMICONDUCTOR LIMITED |
| Yuichi Kurita | Board Director, CFO and Senior Executive Officer of ADVANTEST Corporation | |
| Corporate Auditor | Ryuichi Saitoh | Director of Accounting Dept.I, Corporate Finance Div. FUJITSU SEMICONDUCTOR LIMITED |
| Takayuki Arai | Deputy Manager, Accounting Department and Manager, Accoutning Section, Corporate Administration Group, ADVANTEST Corporation |
Office Location
| Headquarters | Nomura Fudosan Shin-Yokohama Building 10-23, Shin-Yokohama, 2-chome, Kohoku-Ku, Yokohama, Kanagawa |
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| Development office | Akiruno Technology Center | 50 Huchigami, Akiruno-shi, Tokyo, Japan |
| Manufacturing plant | Mie Plant | 1500 Mizono, Tado-cho, Kuwana-shi, Mie-ken, Japan |
Corporate History
| Nov. 2006 | e-Shuttle Inc. is jointly established by FUJITSU Ltd. and Advantest Corporation. |
| Dec. 2006 | Shuttle (MPW) service is begun in cooperation with FUJITSU Ltd. (currently Fujitsu Microelectronics Ltd.) |
| Feb. 2007 | EBDW equipment (the first machine) is introduced -> the development of EBDW process is started. |
| Apr. 2007 | The partner contract is concluded with LSI vendors and mask vendors. -->The expansion of sales route is promoted. |
| Apr. 2007 | The joint development agreement on design for EB (DFEB) is concluded with the D2S Inc.** the development of design technique suitable for EBDW … Productivity improved. |
| Oct. 2007 | Shuttle (MPW) first order is received from the university |
| Jan. 2008 | The shipment of shuttle die manufactured with Electronic Beam Direct Drawing (EBDW) is started. |
| Mar. 2008 | The shipment of COT die by EBDW is started. |
| May. 2008 | The second EB equipment (Refer to the photograph) is introduced -> EBDW process capacity is increased. |
| Sep. 2008 | The partner contract is concluded with Hong Kong Science & Technology Parks Co. (HKSTP) for LSI prototyping for the universities and companies in Asia. |
| Oct. 2008 | e-Shuttle Inc. is approved as a manufacturing vender of the next generation circuit architecture technology development business by Semiconductor Technology Academic Research Center (STARC), and receives the order of the die prototyping for 65 nm generation process research and development. |
| Feb. 2009 | The operation of test die manufactured with DFEB has been confirmed (for the improvement of EBDW productivity) |
| Mar. 2009 | The eBeam Initiative is established and e-Shuttle participates it. -> Ecosystem organization using Maskless lithography with DFEB |
| May. 2009 | EBDW technology is applied to the interconnect process of 65 nm technology. |
| Dec. 2009 | Headquaters are moved to Shin-Yokohama area. |